Design Rules

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This page contains our basic design rules.  They have been adapted from those of the Stanford Nanofabrication Facility, a national center of excellence for microlithography.  We routinely make adjustments to these processes to accommodate special requirements of our customers.  You can order the standard process sequence or any variation that will optimize your product. 

  Clean for Non-standard Metals

  KOH Processing

  Litho Process Edge Bead Removal

  Litho Process Shipley 3612 Photoresist

  Litho Process Shipley 3612 Photoresist

  Litho Processes AZ5214 Image Reversal

  Litho Processes Backside Protection

  Litho Processes Lift-off

  Litho Processes Manual Developing of Resist

  Litho Processes Manual Resist Coating

  Litho Processes SPR220 Thick Resist

  Plasma Etch Nitride Etch Overview

  Plasma Etch Oxide Etch Overview

  Plasma Etch Polysilicon Etch Overview

  TMAH Etching

  Tweezer Cleaning Procedures

  Waveguides

  Wet Oxide Etch

  Wet Oxide Etch2

  Wet oxide Etch 3

  Wet Processes Std Metal Cleaning

  Wet Processes Std PreDiffusion Cleaning

  Wet Processes Std PreLPCVD-PreMetal Cleaning

  Wet Processing Resist Strip

 

                    

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