|
This page contains our basic design rules. They have been
adapted from those of the Stanford Nanofabrication Facility, a
national center of excellence for microlithography. We
routinely make adjustments to these processes to accommodate
special requirements of our customers. You can order the
standard process sequence or any variation that will optimize
your product.
Clean for Non-standard Metals
KOH Processing
Litho Process Edge Bead Removal
Litho Process Shipley 3612 Photoresist
Litho Process Shipley 3612 Photoresist
Litho Processes AZ5214 Image Reversal
Litho Processes Backside Protection
Litho
Processes Lift-off
Litho Processes Manual Developing of Resist
Litho Processes Manual Resist Coating
Litho Processes SPR220 Thick Resist
Plasma Etch Nitride Etch Overview
Plasma Etch Oxide Etch Overview
Plasma Etch Polysilicon Etch Overview
TMAH
Etching
Tweezer
Cleaning Procedures
Waveguides
Wet Oxide Etch
Wet Oxide Etch2
Wet oxide Etch 3
Wet Processes Std Metal Cleaning
Wet Processes Std PreDiffusion Cleaning
Wet Processes Std PreLPCVD-PreMetal Cleaning
Wet
Processing Resist Strip |